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Yoo SW, Cho C, Kim K, Lee H, , You S.  Characteristics of SiO<sub>2</sub> Etching by Capacitively Coupled Plasma with Different Fluorocarbon Liquids (C<sub>7</sub>F<sub>14</sub>, C<sub>7</sub>F<sub>8</sub>) and Fluorocarbon Gas (C<sub>4</sub>F<sub>8</sub>).  Applied Science and Convergence Technology 2021;30:102-106.  
https://doi.org/10.5757/ASCT.2021.30.4.102
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