This study investigates MoS2 plasma etching, a key process in semiconductor manufacturing, using an ICP-RIE system and machine learning to accurately predict post-etch thickness. The results, validated by Raman spectroscopy and XPS, underscore the synergy between AI and experimental methods in advancing semiconductor techniques.
In Ho Seong , Jang Jae Lee , Chul Hee Cho , Yeong Seok Lee, Si Jun Kim , and Shin Jae You
ASCT 2021; 30(6): 176-182
Sophia Nazir and Oh Seok Kwon
ASCT 2022; 31(2): 40-45