
This study investigates MoS2 plasma etching, a key process in semiconductor manufacturing, using an ICP-RIE system and machine learning to accurately predict post-etch thickness. The results, validated by Raman spectroscopy and XPS, underscore the synergy between AI and experimental methods in advancing semiconductor techniques.
Bhimanaboina Ramulu and Jae Su Yu
ASCT 2024; 33(3): 53-61
Daeun Hong, Yongjae Kim, and Heeyeop Chae
ASCT 2024; 33(1): 1-6
ASCT
in Mobile