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Applied Science and Convergence Technology 1993; 2(3): 374-383

Published online September 1, 1993

Copyright © The Korean Vacuum Society.

The Interface Adhesion of Diamond Thin Film Grown on Si by EACVD

C. R. Lee,J. H. Park,J. Y. Leem,K. S. Kim,B. S. Chun

Abstract

The diamond thin films on Si which 20 V (Film A), 80 V (Film B), 140 V (Film C) and 200 V (Film D) had been applied respectively between filament and Si substrates during growth were analysed with SEM, HRTEM and AES. Judging from those results, the diffusion of carbon increased due to the increment of the energy of active hydrocarbon ion (C_mH_n^-) and also the SiC layers were formed as the result of chemical bonding of C_mH_n^- with Si. The amount and depth of SiC layer increased as the potentials increased. The interface adhesion of these films were also measured with Pull test which is the most accurate and general method in evaluation of thin film adhesion. The film (D) which SiC was formed most deeply and widely exhibited the most adhesion in diamond/Si interface. Meanwhiles, the film (A) which had most shallow SiC layer and low SiC concentration exhibited very weak adhesion compare to film (D). Judging from the observation and X-Ray Mapping of fracture surface, the film (D) was fractured in Si below interface and the film (A) was fractured in diamond thin film/Si interface. Also, there are many voids in film (A) and a little in film (D). Conclusively, it is possible to grow the high strength and condensed diamond thin film without pores because the energy of active hydrocarbon ion was increased by elevation of potentials during growth.

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